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Place of Origin:Guangdong, China (Mainland)
Model Number:PG83
Standard:GB
Material:Copper
Head type:Flat
Size:Customized
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PE bags and carton, according to your demand
Delivery Time
12 days
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| Main Markets | Total Revenue(%) |
| Southeast Asia | 20% |
| South Asia | 20% |
| Mid East | 20% |
| Eastern Europe | 18% |
| Northern Europe | 10% |
| North America | 10% |
| Africa | 2% |
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Effect of hydrogen evolution: During electroplating, hydrogen evolution is a very important factor that causes blistering of the coating. This is because if there is cracks and micropores on the surface of the base metal during the electrolysis and electroplating process, a certain amount of adsorbed hydrogen will accumulate. In the electroplating of copper-tin alloys, if the free sodium cyanide content in the plating bath is too high or the cathode current density is too large, a large amount of hydrogen will precipitate on the cathode surface, and a part of hydrogen will also infiltrate or be adsorbed on the surface of the base metal. And micro holes, etc. After a layer of plating is applied on the surface of the hydrogen- or hydrogen-absorbing article, when the coating is coated and the ambient temperature increases, a pressure is applied to the coating due to the expansion overflow, so that the coating is detached from the substrate and protrudes. Foaming